temd5510fx01 www.vishay.com vishay semiconductors rev. 1.5, 28-oct-11 1 document number: 81293 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 ambient light sensor description temd5510fx01 ambient light sensor is a pin photodiode with high photo sensitivity in a miniature surface mount device (smd). the detector chip has 7.5 mm 2 sensitive area. it is sensitive to visible light much like the human eye and has peak sensitivity at 540 nm. features ? package type: surface mount ? package form: top view ? dimensions (l x w x h in mm): 5 x 4.24 x 1.12 ? radiant sensitive area (in mm 2 ): 7.5 ? aec-q101 qualified ? high photo sensitivity ? adapted to human eye responsivity ? supression filter for ne ar infrared radiation ? angle of half sensitivity: ? = 65 ? floor life: 72 h, msl 4, acc. j-std-020 ? lead (pb)-free reflow soldering ? compliant to rohs directive 2002/95/ec and in accordance to weee 2002/96/ec note ** please see document vishay material category policy: www.vishay.com/doc?99902 applications ? automotive sensors ? ambient light sensors ? backlight dimmers ? notebooks ? computers note ? test conditions see table basic characteristics note ? moq: minimum order quantity 20535 product summary component i ra (a) ? (deg) 0.5 (nm) temd5510fx01 26 65 430 to 610 ordering information ordering code packaging remarks package form temd5510fx01 tape and reel moq: 1500 pc s, 1500 pcs/reel top view absolute maximum ratings (t amb = 25 c, unless otherwise specified) parameter test condition symbol value unit reverse voltage v r 16 v power dissipation t amb 25 c p v 215 mw junction temperature t j 100 c operating temperature range t amb - 40 to + 100 c storage temperature range t stg - 40 to + 110 c soldering temperature acc. reflow solder profile fig. 5 t sd 260 c thermal resistance junction/ambient soldered on pcb with pad dimensions: 4 mm x 4 mm r thja 350 k/w
temd5510fx01 www.vishay.com vishay semiconductors rev. 1.5, 28-oct-11 2 document number: 81293 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 basic characteristics (t amb = 25 c, unless otherwise specified) fig. 1 - reverse dark current vs. ambient temperature fig. 2 - reverse light current vs. irradiance fig. 3 - relative spectral sensitivity vs. wavelength fig. 4 - relative radiant sensitivity vs. angular displacement basic characteristics (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit breakdown voltage i r = 100 a, e = 0 v (br) 16 v reverse dark current v r = 10 v, e = 0 i ro 230na diode capacitance v r = 0 v, f = 1 mhz, e = 0 c d 1600 pf v r = 3 v, f = 1 mhz, e = 0 c d 730 pf reverse light current e e = 1 mw/cm 2 , = 550 nm, v r = 5 v i ra 26 a e v = 100 lx, cie illuminant a, v r = 5 v i ra 0.8 1 1.4 a temperature coefficient of i ra e v = 100 lx, cie illuminant a, v r = 5 v tk ira 0.2 %/k angle of half sensitivity ? 65 deg wavelength of peak sensitivity p 540 nm range of spectral bandwidth 0.5 430 to 610 nm 20 40 60 80 1 10 100 1000 100 94 8403 v r = 10 v t am b - am b ient temperat u re (c) i ro - re v erse dark c u rrent (na) 0.1 1 10 100 1000 10 100 1000 10000 e v - ill u minance (lx) i ra - photoc u rrent (a) cie ill u minant a v r = 5 v 20080 0.0 0.2 0.4 0.6 0.8 1.0 400 600 800 1000 w a v elength (nm) relati v e spectral sensiti v ity photodiode h u man eye 20047 0.4 0.2 0 s - relati v e sensiti v ity rel 94 8406_1 0.6 0.9 0.8 0 30 10 20 40 50 60 70 80 0.7 1.0 ? - ang u lar displacement
temd5510fx01 www.vishay.com vishay semiconductors rev. 1.5, 28-oct-11 3 document number: 81293 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters dra w ing- n o.: 6.541-5060.01-4 iss u e: 3; 05.02.08 20536 n ot indicated tolerances 0.1
temd5510fx01 www.vishay.com vishay semiconductors rev. 1.5, 28-oct-11 4 document number: 81293 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 taping dimensions in millimeters reel dimensions in millimeters 20537 20874
temd5510fx01 www.vishay.com vishay semiconductors rev. 1.5, 28-oct-11 5 document number: 81293 for technical questions, contact: detectortechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solder profile fig. 5 - lead (pb)-free reflow solder profile acc. j-std-020d drypack devices are packed in moisture barrier bags (mbb) to prevent the products from moisture absorption during transportation and storage. each bag contains a desiccant. floor life time between soldering and re moving from mbb must not exceed the time indicated in j-std-020: moisture sensitivity: level 4 floor life: 72 h conditions: t amb < 30 c, rh < 60 % drying in case of moisture absorpti on devices should be baked before soldering. conditions see j-std-020 or recommended conditions: 192 h at 40 c (+ 5 c), rh < 5 % or 96 h at 60 c (+ 5 c), rh < 5 %. 0 50 100 150 200 250 300 0 50 100 150 200 250 300 time (s) temperat u re (c) 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 30 s max. ramp u p 3 c/s max. ramp do w n 6 c/s 19841 255 c
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